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[n]	N. A. Stilin et al., “Conduction-Cooled SRF Cavities: Opportunities and Challenges”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 973-977. doi:10.18429/JACoW-SRF2023-THIXA05

[n]	R. Oweiss et al., “Development of Quality Control Procedures for the Processing of ReA3 Copper Plated Fundamental Power Coupler”, in Proc. SRF'13, Paris, France, Sep. 2013, paper THP053, pp. 1031-1035. 

For LaTeX

%\cite{Stilin:SRF23-THIXA05} \bibitem{Stilin:SRF23-THIXA05} N. A. Stilin \emph{et al.}, \textquotedblleft{Conduction-Cooled SRF Cavities: Opportunities and Challenges}\textquotedblright, in \emph{Proc. SRF’23}, Grand Rapids, MI, USA, Jun. 2023, pp. 973--977. \doi{10.18429/JACoW-SRF2023-THIXA05} %\cite{Oweiss:SRF13-THP053} \bibitem{Oweiss:SRF13-THP053} R. Oweiss \emph{et al.}, \textquotedblleft{Development of Quality Control Procedures for the Processing of ReA3 Copper Plated Fundamental Power Coupler}\textquotedblright, in \emph{Proc. SRF’13}, Paris, France, Sep. 2013, paper THP053, pp. 1031--1035.

For BibTeX

@inproceedings{stilin:srf23-thixa05, author = {N. A. Stilin and others}, title = {{Conduction-Cooled SRF Cavities: Opportunities and Challenges}}, booktitle = {Proc. SRF'23}, pages = {973--977}, paper = {THIXA05}, venue = {Grand Rapids, MI, USA}, series = {International Conference on RF Superconductivity}, number = {21}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {2023}, issn = {2673-5504}, isbn = {978-3-95-450234-9}, doi = {10.18429/JACoW-SRF2023-THIXA05}, language = {english} } @inproceedings{oweiss:srf13-thp053, author = {R. Oweiss and others}, title = {{Development of Quality Control Procedures for the Processing of ReA3 Copper Plated Fundamental Power Coupler}}, booktitle = {Proc. SRF'13}, pages = {1031--1035}, paper = {THP053}, venue = {Paris, France, Sep. 2013}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2013/papers/THP053.pdf}, language = {english} }

References

• N. A. Stilin et al., “Conduction-Cooled SRF Cavities: Opportunities and Challenges”, in Proc. 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper THIXA05, pp. 973-977.
• R. Oweiss et al., “Development of Quality Control Procedures for the Processing of ReA3 Copper Plated Fundamental Power Coupler”, in Proc. 16th Int. Conf. RF Superconductivity (SRF'13), Paris, France, Sep. 2013, paper THP053, pp. 1031-1035.